EOS GmbH, based in Krailling, Germany, has expanded its offerings of metal powders for Laser Beam Powder Bed Fusion (PBF-LB) Additive Manufacturing. The new powders include EOS NickelAlloy IN718 API for the Oil & Gas industry and EOS Nickel NiCP for the semiconductor sector.
EOS NickelAlloy IN718 API: A Solution for Oil & Gas
EOS NickelAlloy IN718 API is a nickel-based alloy that excels in low temperatures and resists corrosion. It suits high-stress applications in the Oil & Gas sector. Additionally, the material offers a tensile strength of 878 MPa and 27% elongation when treated, enhancing its overall performance. It meets API 6ACRA standards, which makes it ideal for manufacturing parts like downhole tools, injection systems, fixtures, and fasteners.
A leading inflow control technology provider adopted IN718 API early on. They produced a flow module component that met API standards, withstanding high stress and corrosion in oil and gas environments. The company can now explore 3D printing as a manufacturing method, ensuring consistent performance.
“Additive Manufacturing was previously unsuitable for downhole applications due to strict oil and gas industry standards,” said the customer. “EOS NickelAlloy IN718 API enables us to consider 3D printing without sacrificing part performance.”
EOS Nickel NiCP: Advancing Semiconductor Applications
Designed specifically for the semiconductor industry, EOS Nickel NiCP provides a tensile strength of 400 MPa and 49% elongation. As a result, it is ideal for manufacturing gas injectors and corrosion-resistant components for semiconductor equipment.
Traditionally, parts in the semiconductor industry undergo electroless nickel plating to improve corrosion resistance. With EOS Nickel NiCP, plating is not necessary, which extends component life. This method not only eliminates hazardous waste but also offers a cleaner, more sustainable manufacturing option, contributing to long-term environmental benefits.
“Additive manufacturing improves machine uptime, boosting wafer fabrication throughput and increasing revenue for end users,” said Sophia Heyl, EOS Product Specialist.
Dr. Ankit Saharan, EOS Director of Metals Technology, stated, “EOS Nickel NiCP has already proven reliable in production. Expanding its availability strengthens our engagement with the semiconductor sector and drives innovation in additive manufacturing.”
EOS remains committed to advancing the semiconductor industry by introducing these innovative materials.
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