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Alloy Enterprises has launched its copper direct liquid cooling solution to reduce the energy use of AI data centres. Enabled by metal additive manufacturing technology, the company's proprietary Stack Forging offering has been designed to address the challenges that traditional cooling methods face as chip power densities and thermal design power continue to rise. It does this by combining the material properties of wrought aluminium and copper with novel geometries that can only be produced with additive manufacturing. With Stack Forging, Alloy Enterprises targets liquid cooling where heat loads are highest, achieving up to 10x reduction in pressure drop and eliminating leak points through single-piece construction. The launch of the copper direct liquid cooling solution, Alloy Enterprises is expanded beyond its existing aluminium offerings and now provides cooling components that meet ASHRAE standards for chemical compatibility. "Alloy Enterprises is setting a new standard in direct liquid cooling technology with our proprietary Stack Forging process,” said Ali Forsyth, PhD., CEO and Co-founder of Alloy Enterprises. “We now deliver industry-leading thermal performance in both aluminium and copper, enabling higher rack densities, significant cost savings and greater sustainability. With 600 kW racks on the horizon, the shift to liquid cooling is no longer optional—it's mission-critical.” With the superior pressure drop reduction offered by Alloy's Stack Forged DLC components, data centres can use 44°C (111.2°F) water and smaller pumps, eliminating the need for refrigerated HVAC systems. The result, Alloy Enterprises says, is a reduction in data centre energy consumption by up to 23%. For hyperscalers and colocation providers, Alloy suggests these efficiency gains will translate directly to increased revenue and reduced costs. More efficient cooling means more AI tokens can be sold with significantly lower energy costs, while maximising compute density per square foot could see users improve power usage effectiveness (PUE) and reduce total cost of ownership. "Alloy's copper line is already showing promising results in early customer deployments," added Forsyth. "These components are hitting target thermal resistance thresholds while maintaining exceptional pressure drop performance, even in the most demanding rack configurations." — Alloy Enterprises Copper direct liquid cooling solution

Innovative Copper Cooling with 3D Printing Transforms AI Data Centres

Alloy Enterprises has launched a cutting-edge copper direct liquid cooling solution designed for AI data centres. The company uses metal additive manufacturing to create its proprietary Stack Forging components. These components combine the thermal conductivity of copper with novel geometries only achievable through 3D printing. As chip power densities rise, Alloy’s technology addresses traditional cooling limitations by drastically reducing pressure drops and eliminating leaks via single-piece construction.

This new copper cooling solution expands Alloy Enterprises’ offerings beyond aluminium components. It meets ASHRAE chemical compatibility standards, ensuring durability in demanding environments. The Stack Forging method targets the highest heat loads directly, improving cooling efficiency and system reliability.

Stack Forging Technology Drives Energy Efficiency and Cost Savings

Alloy Enterprises’ Stack Forged copper components enable data centres to operate with 44°C water and smaller pumps. Consequently, the need for energy-intensive refrigerated HVAC systems decreases substantially. In fact, this technology can reduce data centre energy consumption by up to 23%. Such energy savings directly benefit hyperscalers and colocation providers through increased revenue potential and lower operational costs. Moreover, higher compute density per square foot improves power usage effectiveness (PUE), thus optimizing total cost of ownership.

CEO Ali Forsyth highlights the growing importance of liquid cooling in managing AI workloads. Meanwhile, early customer deployments of the copper Stack Forged components demonstrate excellent thermal resistance and low pressure drops, even in complex rack setups. Therefore, these results position Alloy Enterprises at the forefront of sustainable, high-performance data centre cooling solutions.

SuperMetalPrice Commentary:

Alloy Enterprises’ launch of a 3D printed copper direct liquid cooling system marks a significant advance in thermal management for AI data centres. By leveraging metal additive manufacturing, Alloy addresses critical energy efficiency challenges while improving performance. Furthermore, the reduction in energy use and operational costs aligns with the broader industry shift toward sustainable data centre infrastructure. As AI workloads grow and chip densities increase, innovations like Stack Forging will become essential for maintaining scalable and cost-effective cooling solutions.