KovarㅣUNS K94610

1. Introduce – An Fe-Ni-Co alloy with low thermal expansion – Materials with thermal expansion coefficients similar to those of ceramics and glass – Materials used for sealing and bonding semiconductor components and electronic devices (for “glass-to-metal” and “ceramic-to-metal” bonding) 2. Application & Product – Electrical, Electronic ApplicationProductElectricalIgniters, magnetrons, transistors, relays, integrated circuits, cathode-ray tubes, vacuum tubesElectronicSemiconductor components, electronic product sealing and bonding materials, high-energy emission tu...