Kovar(Ni-Co)

1. Introduce – Material similar to the thermal expansion rate of ceramics and glass→ Kovar : Low thermal expansion Fe-Ni-Co alloy→ Material applied as a sealing and bonding material for semiconductor parts, electronic products(For glass-to-metal, ceramic-to-metal bonding) – UNS K94610 * Kovar bonding properties – Most metals cannot be joined with glass and ceramics due to different thermal expansion rates, but Kovar can be joined due to the matching thermal expansion rates – Bonds to glass and ceramics through an intermediate oxide layer of Ni oxide and Co oxide [Therma...